Automated Thermal Stress System

ATSS-30

ATSS-80

Thermotron's Automated Thermal Stress System is a versatile chamber designed to accelerate Thermal Stress Testing. These chambers facilitate extremely rapid product temperature change rate performance in a space-saving, self-contained design - maximizing throughput while minimizing footprint. Set-point margining software optimizes product temperature recovery performance via controlled temperature offset. Thermotron's ATSS chambers meet the latest MIL-STD 883E & 202F thermal shock specs as well as JEDEC and IPC test methods. Rapid thermal shocking, accelerated product stressing, and controlled thermal cycling are all possible. These chambers meet the demanding test needs of many industries such as: Automotive, Military, Aerospace, Electronics, Telecommunications, and Computers & Peripherals.

High volume airflow is delivered to each zone via powerful circulator motors and blower wheels. Finned cooling coils in both zones draw the airflow directly over the area occupied by the product under test. Bi-directional cooling and heating is incorporated in both the hot and cold zones. This feature allows air temperature overshoots or offsets to be closely controlled in an effort to maximize product temperature change rates or recovery.

The ATSS-30, ATSS-80 and ATSS-130 are automatically controlled by Thermotron's 8825 Microprocessor-based Programmer / Controller. This instrument is specifically designed for use in thermal shock testing.